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Advances in Interconnect & Assembly Technologies for Next Generation Electronic Systems
iNEMI TV
Dec 20, 2022
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iNEMI Packaging Tech Topic Series: "Role of EDA in Advanced Semiconductor Packaging"
Counterfeit Components Tech Topic Series: Emerging Trends in Counterfeit Detection and Mitigation
Board Assembly Tech Topic Series: Mechanical Shock Drop Reliability of BiSn LTS
End-of-Project Webinar: iNEMI mmWave Permittivity Reference Material Development Project
iNEMI Tech Topic Series: Counterfeit Components / Session 1 — Size & Breadth of Counterfeit Risks
2024.August.29| JHCTECH New Product Launch Announcement - SIGM-2660/2661 and MITX-I984
Vertical GaN™ - Unlocking the full potential of GaN
SMART Modular: CXL Memory Expansion Advantages
Webinar - The Frontier of Metal AM
FAA Punished SpaceX Unfairly And Musk Respond!
iNEMI End-of-Project Webinar: Unified Equipment Interaction Methodology (April 16 & 17, 2024)
Here's How NVIDA's New 'Eagle Eye' Will Change The World Forever
iNEMI LTS Tech Topic Series — Electromigration in Tin-Bismuth Planar Solder Joints
Challenges Of Using IEC 62443 To Secure IIoT
Nematic Liquid Crystals for mm-Wave Reconfigurable Intelligent Surfaces: a Hardware Perspective
iNEMI Tech Topic Series: Counterfeit Components, Session 2 — Counterfeit Management & Best Practices
AMRs in the Morning - Live Presentations
iNEMI Comparison of Expanded Beam & Physical Contact Connectors in Data Center Applications Project
No, Einstein Didn’t Solve the Biggest Problem in Physics
iNEMI Connector Reliability Test Recommendations End-of-Project Webinar (February 26 & 27, 2024)